Tyn Jian International Co., Ltd.

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1. Wire Saw DS261

Wire saws是目前高精密切割中的最新發展.此高科技產品專為以下工件之切割
加工所設計開發:silicon, Germanium, Gallium-Aresenide, Ceramics, Glass,
Ferrite,及其他半導體相關產業工件.低warp及TTV是M+B ...

2. 富士產機雙面研磨機

特性：雙面砥石同步研磨，厚度可達5m以下，表面粗度Ra 0.1mm以內。
用途：各類金屬及非金屬材質。（玻璃、陶瓷、碳化鎢、銅、鋁）
h following patents to assure e

3. CMP DRESSER＆I.D BLADE

1. Increase life time
2. Reduce uniformity
3. Stable remove rate
4. No diamond lost
5. No micro scratch

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